January 29, 2011
The Dow Chemical Co. has introduced ENLIGHT™ polyolefin encapsulant films, designed to help enhance efficiencies in photovoltaic module production.
The films can provide module stability and improved electrical performance, according to the manufacturer. They are suitable for CSi and thin-film modules. The physical properties nearly eliminate bubbles, which leads to fewer rejects. Damage to equipment and modules is reduced because the process does not produce acetic acid.
The film can be formulated to address specific module-design needs. It allows excellent adhesion to glass under various lamination conditions, according to the company, and shows no creep in use.
The Dow Chemical Co. • 800-441-4369 • www.dow.com
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